Electronic Communications and Computer Engineering Masters (MSc)

Duration: 1 year full-time

Course Content

This is a highly flexible course, which gives you the opportunity to choose modules according to your specific interests and requirements.

During the autumn and spring semesters, you will complete 120-credits’ worth of taught modules.

After completing the taught components of the course, you will undertake a major piece of advanced independent research over the summer under the supervision of a specialist in your chosen area. We will provide you with advice and guidance while you select and refine your area of study, and offer close supervision and support as you complete your research and your MSc.


Course Structure

The MSc Electronic Communications and Computer Engineering is studied on a full-time basis over 12 months.

This course operates on a modular basis and consists of two semesters - during which you will follow a series of taught modules (worth 120 credits) - followed by a 60-credit research project undertaken during the summer period.

You will be taught using the latest advances in teaching methods and electronic resources, as well as small-group and individual tuition.

Most taught modules are assessed by examination and/or written work.

Tutors provide feedback on assignments. Our objective is to help you develop the confidence to work as a professional academic, at ease with the conventions of the discipline, and ready to tackle any area of research in Electronic Communications and Computer Engineering.

In the early stages of your project dissertation, your supervisor will read through and comment on your draft work. The project dissertation itself comprises a significant piece of your own research.

We also offer a Postgraduate Diploma Electronic Communications and Computer Engineering, which – unlike the MSc – does not have a dissertation requirement.

Modules

MSc Project
In this module a student will be assigned to an individual supervisor who will be a staff member in the Department of Electrical and Electronic Engineering. The student will carry out a practical or theoretical project chosen from the current interests of the staff member concerned. The student will be expected to conduct a literature survey, undertake practical or theoretical work and write a dissertation on this work.
Control Systems Design
This module enables students to design both analogue and digital controllers for linear single-input single-output systems. Students have access to CAD control design packages for evaluating control design. This module covers:
  • design of analogue controllers using Root Locus Method
  • closed loop performance and frequency response
  • microprocessor implementation
  • practical problems in digital control
  • design of digital controllers using z-plane techniques
  • practice with CAD package.
Electronic Design
This module covers further topics relevant to the design of analogue circuits including:
  • Bipolar Junction Transistor small signal models & single stage amplifier configurations
  • MOSFET/JFET small signal models & single stage amplifier configurations
  • High-frequency models and the Miller effect
  • Biasing using active loads, current mirrors and current sources
  • Cascode & cascaded two-stage BJT and MOSFET amplifiers
  • Differential pair amplifier
  • Two-stage operational amplifier
  • Electrical noise models and calculations
Solid State Devices
This module seeks to develop a detailed understanding of the internal operating mechanisms of semiconductor electronic and opto-electronic devices. The module will focus on devices based on pn junctions (e.g. diodes, bipolar junction transistors) and devices based on MOS capacitors (e.g. memory cells, CCD detectors, MOSFETs). The module will consider how the targeted application for a device impacts upon its design. (For example, signal-mixing diodes, power diodes, light-emitting diodes, laser diodes, photodetectors and solar cells are all based upon the pn diode, but provide very different functionality.) The characteristics required of these devices will be discussed in relation to their incorporation into appropriate electronic systems.
Digital Communications
This module is an introduction to the operation of modern digital communication systems. Topics covered include:
  • communication systems
  • information content and channel capacity
  • digital modulation techniques
  • data compression techniques
  • error-correcting and line coding techniques
  • digital signal regeneration techniques
  • system examples,FAX, Teletext, NICAM and CD technologies.
VLSI Design
This module provides an in-depth understanding of both full and semi custom CMOS integrated circuit design. It is biased towards electronic systems rather than solid state devices. The module covers:
  • CMOS gate DC and transient performance
  • CMOS chip fabrication processes
  • Analysis of delays in logic gates driving capacitive loads, and their buffering
  • VLSI layout design techniques, rules and limitations
  • Electrical parameters and measurement of parasitics
  • Power dissipation - static and dynamic
  • Combinational/Sequential/Peripheral circuit designs
  • Custom and semi-custom design styles
  • Scaling of integrated circuit dimensions
  • Chip yield and economics
  • Self-study CAD laboratory exercise with a pre- and post-layout cell design
Digital Signal Processing for Telecommunications, Multimedia and Instrumentation with Project
This module provides an introduction to digital signal processing. The module covers:
  • revision of continuous signals, linear time-invariant systems and Fourier transform
  • sampling of analogue signals, discrete time-invariant systems, and discrete Fourier transform
  • signal enhancement techniques
  • digital spectral analysis
  • design of digital FIR filters
  • design of digital IIR filters
  • adaptive signal processing
  • multidimensional signal processing
  • implementations of digital signal processing, and acoustic and optical signal processing
  • use of MATLAB for signal processing
Power Electronic Design
This module provides students with an understanding of the operational principles of power electronic converters and their associated systems. This module covers:
  • 3-phase naturally commutated ac-dc/dc-ac converters
  • capacitive and inductive smoothing - device ratings
  • dc-ac PWM inverters and modulation strategies
  • resonant converters
  • high power factor utility interface circuits
  • power converter topologies for high power (multilevel)
Instrumentation and Measurement
This module is an introduction to the principles and practice of instrumentation and measurement systems in an engineering context. The module will cover the generally applicable basic principles and then look at specific classes of instrument and associated electronics and signal processing methods. Topics covered include:
  • Basic principles and instrument characteristics.
  • Measurement errors, basic statistics, noise and its control.
  • Dynamic characteristics of instruments, time and frequency domain responses.
  • System identification using correlation techniques.
  • Amplifiers, filters, ADCs and DACs.
  • Position, strain, pressure and motion sensors (resistive, capacitive, inductive, optical).
  • Flow sensors.
  • Ultrasonic sensors.
Digital Signal Processing for Telecommunications, Multimedia and Instrumentation
This module provides an introduction to digital signal processing. The module covers:
  • revision of continuous signals, linear time-invariant systems and Fourier transform
  • sampling of analogue signals, discrete time-invariant systems and discrete Fourier transform
  • signal enhancement techniques
  • digital spectral analysis
  • design of digital FIR filters
  • design of digital IIR filters
  • adaptive signal processing
  • multidimensional signal processing
  • implementations of digital signal processing, and acoustic and optical signal processing
  • use of MATLAB for signal processing
Instrumentation and Measurement with Project
This module is an introduction to the principles and practice of instrumentation and measurement systems in an engineering context. The module will cover the generally applicable basic principles and then look at specific classes of instrument and associated electronics and signal processing methods. Topics covered include:
  • Basic principles and instrument characteristics.
  • Measurement errors, basic statistics, noise and its control.
  • Dynamic characteristics of instruments, time and frequency domain responses.
  • System identification using correlation techniques.
  • Amplifiers, filters, ADCs and DACs.
  • Position, strain, pressure and motion sensors (resistive, capacitive, inductive, optical).
  • Flow sensors (correlation, acoustic, electromagnetic, mechanical).
  • Ultrasonic sensors.
    The coursework will be in the form of a design or case study in a business context.
  • Telecommunication Electronics
    This module covers the design and analysis of electronic systems used in telecommunications especially radio:
    • oscillators
    • amplifiers
    • PLL
    • mixers.
    Web Based Computing
    The Module introduces the Java programming language, and the netBeans IDE as tools to develop applications for devices from mobile phones, to the web. The windows desktop applications of today are being joined and replaced by web based applications, and mobile applications, as the power of these devices continues to increase. Powerful graphics and real time applications are needed which can run in a number of environments. The Write Once Run Many (WORM) ideas behind Java under pin many web based tools. The netBeans IDE, is used for all of the laboratory work,
    RF Microelectronics
    The design of high speed Analogue and Digital circuits will be discussed before the limitations of BJTs and MOSFETs are given. High speed HEMT and HBTs will be examined.
    RF Microelectronics with project
    The design of high speed Analogue and Digital circuits will be discussed before the limitations of BJTs and MOSFETs are given. High speed HEMT and HBTs will be examined.
    Integrated Photonics: Design and Technology
    The module aims to provide an in depth overview of current state-of-the-art integrated photonics technologies and devices. The module provides: - introduction to optical integrated circuits; - review of current issues in monolithic and hybrid technologies; - review of materials and fabrication techniques for integrated photonics; - in depth introduction on passive and active devices in integrated photonics; - an overview of available characterisation techniques; - overview of a range of commonly used design and simulation methodologies including Finite Difference Beam Propagation Method (FDBPM), Finite Difference Time Domain (FDTD) method and Spectral Index (SI) method; - coverage of applications in integrated photonics including switching, biophotonics, correlators and spectrum analysis. - a review of emerging technologies such are nano-imprint lithography, embossing, micro-resonators, photonic bandgap devices and plasmonics.
    Engineering Ultrasonics
    This module is an introduction to the principles and applications of ultrasound in a wide range of engineering industries. The module will cover the theory of ultrasonic wave propagation in engineering structures together with the practicalities of ultrasonic test instrumentation and systems and data analysis. The course concludes with a series of case studies. Topics include: Ultrasonic wave propagation in different media Piezoelectric, EMAT, phased array and SAW devices Pulser-receiver instrumentation Ultrasonic test methods Time and frequency domain data analysis Defect detection in engineering structures Case studies (medical, aerospace and process control)
    Engineering Ultrasonics with Project
    This module is an introduction to the principles and applications of ultrasound in a wide range of engineering industries. The module will cover the theory of ultrasonic wave propagation in engineering structures together with the practicalities of ultrasonic test instrumentation and systems and data analysis. The course concludes with a series of case studies. Topics include: Ultrasonic wave propagation in different media Piezoelectric, EMAT, phased array and SAW devices Pulser-receiver instrumentation Ultrasonic test methods Time and frequency domain data analysis Defect detection in engineering structures Case studies (medical, aerospace and process control)
    Optical Communications
    This module provides an in depth knowledge of optical communication systems and networks. After some introductory material the topics covered include: Optical fibres (light propagation in fibres, attenuation, chromatic dispersion, PMD, fibre nonlinearities) Optical components overview (transmitters (lasers, LEDs), detectors (PIN, APD), optical amplifiers (SOA, EDFA, Raman) and optical regeneration, multiplexers, filters, couplers, isolators, circulators, wavelength converters, optical switches etc.) Modulation and demodulation (signal formats, noise, BER, Q, error detection/codes, Optical System Design (impairments: extinction ratio, receiver thermal noise, basic receiver sensitivity, optical amplifier noise, crosstalk, dispersion, PMD, nonlinearity (partic. SBS, SRS, FWM), penalties (Q, Power, Eye, OSNR)) Optical networks (WDM network elements, topology design, routing and wavelength allocation, network survivability, access networks)
    Photonics: Modelling, Analysis and Design
    The module aims to cover the analysis, modelling and design of a wide range of primarily fibre optics based photonic devices that are currently used in photonic telecoms:
    • i) fibres;
    • ii) fibre amplifiers: EDFA, Raman and Brillouin;
    • iii fibre couplers, taps, optical isolators and circulators;
    • iv) fibre lasers;
    • v) photonic crystal fibres;
    • vi) photonic crystal fibre based photonic devices;
    • vii) modelling of integrated photonic devices including semiconductor lasers;
    • viii) basic numerical modelling techniques (e.g. Split Step Fourier Method, FD-BPM, etc)
    • ix) modelling of active photonic devices (electronic, photonic, thermal)
    Embedded Computing
    Architectures for embedded programmable digital electronics; operation of a microcontroller and its programming; assembly language directives and instructions; interfacing of microcontrollers; embedded peripherals and interrupts in microcontrollers; communications for embedded computing; special features of microcontrollers (the above items are based on the PIC16 microcontroller family); various microcontroller families; introduction to larger scale embedded systems.
    Microwave Communications
    This module provides an overview of microwave telecommunication systems. Topics cover characteristics of atmosphere and ionosphere, microwaves in free space (the link equation, satellite communications, microwave radio links, remote sensing (RADAR)), microwave waveguides and devices (coaxial cable, microstrip/ striplines, rectangular and circular waveguides, periodic structures and filters), transmission line equivalents of microwave circuits, matrix representation of microwave networks (transfer matrix, scattering matrix) and impedance matching.
    Mobile Communications
    This module contains
    • Propagation characteristics of mobile environment – wave equations, fading
    • Cells and channel allocation
    • Digital modulation techniques
    • Multiplexing, FDMA, TDMA, CDMA
    • Error detection and coding
    • 2nd generation systems (GSM, IS-136, IS-95)
    • 2.5/3G systems
    • Wireless LAN
    • Blue tooth
    • 4G
    Applied Computational Engineering
    This module covers the development of advanced engineering software projects, spanning a range of application areas. Generic Topics to be discussed include: Large-scale software management, robust design and coding techniques, accurate and efficient numerical computing for technological simulations, parallel computing techniques applicable to several classes of parallel computer e.g. multicore, distributed and graphics processing unit (GPU) based systems, database design and implementation; distributed network based computing; hardware interfacing.
    Optical Communications and Networks
    This module provides an introduction to optical communication systems and networks. Topics covered include: Optical fibres (light propagation in fibres, attenuation, chromatic dispersion, PMD, fibre nonlinearities) Optical components overview (transmitters, detectors, optical amplifiers (SOA, EDFA, Raman) and optical regeneration, multiplexers, filters, couplers, isolators, circulators, wavelength converters, optical switches etc.) Modulation and demodulation (signal formats, noise, BER, Q) Optical networks (WDM network elements, topology design, routing and wavelength allocation, network survivability, access networks)
    Mobile Communications with Project
    This module contains:
    • Propagation characteristics of mobile environment – wave equations, fading
    • Cells and channel allocation
    • Digital modulation techniques
    • Multiplexing, FDMA, TDMA, CDMA
    • Error detection and coding
    • 2nd generation systems (GSM, IS-136, IS-95)
    • 2.5/3G systems
    • Wireless LAN
    • Blue tooth
    • 4G
    HDL for Programmable Logic with Project
    This course will be divided into three: taught material, a hands-on lab exercise and a hands-on project.
    TAUGHT MATERIAL This will contain the following:
    • HDL overview and latest developments
    • Latest relevant software from Xilinx and Mentor Graphics
    • VHDL syntax
    • VHDL testbench design
    • Combinational and sequential circuit design
    • Finite State Machine VHDL design

    LABORATORY EXERCISES The lab classes will be tightly integrated with the lecture sessions. The lab exercises, directly related to the lecture material will be implemented on a pre-prepared FPGA development board. PROJECT realisation of a digital system will be implemented. Marks will be awarded for: quality of code; functionality of the design; written report; plus other parameters to be specified during the course.
    HDL for Programmable Logic
    This course will be divided into two: taught material and a hands-on lab exercise.
    TAUGHT MATERIAL This will contain the following:
    • HDL overview and latest developments
    • Latest relevant software from Xilinx and Mentor Graphics
    • VHDL syntax
    • VHDL testbench design
    • Combinational and sequential circuit design
    • Finite State Machine VHDL design

    LABORATORY EXERCISES The lab classes will be tightly integrated with the lecture sessions. The lab exercises, directly related to the lecture material will be implemented on a pre-prepared FPGA development board.
    Applied Computational Engineering
    This module covers the development of advanced engineering software projects, spanning a range of application areas. Generic Topics to be discussed include: Large-scale software management, robust design and coding techniques, accurate and efficient numerical computing for technological simulations, parallel computing techniques applicable to several classes of parallel computer e.g. multicore, distributed and graphics processing unit (GPU) based systems, database design and implementation; distributed network based computing; hardware interfacing.
    Bioelectronic and Biophotonic Interfacing
    This module explores the design of interfaces between technology and biology. It will cover the use of a variety of physical phenomena, including electrical and optical signals, to both monitor and control biological systems. Technology used in research laboratories, medical diagnostic equipment and personal electronic devices will be considered. The module will emphasise the design of practical technology.
    Topics covered include:
    • Basic physical principles
    • Basic biological principles
    • Electronic interfacing
    • Optical interfacing
    • Magnetic interfacing

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    Helen Tanner
    Engineering Student Support Centre
    Engineering and Science Learning Centre (ESLC)The University of Nottingham
    University Park
    Nottingham
    NG7 2RD


    t: +44 (0)115 951 4163

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